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Tungsten Copper Alloy Materials Electronic Packaging Base Flanges

Luoyang Hypersolid Metal Tech Co., Ltd
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Tungsten Copper Alloy Materials Electronic Packaging Base Flanges

Brand Name : Hypersolid Metal

Place of Origin : China

MOQ : Negotiate

Price : Negitionable

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 10000sets/month

Delivery Time : 30 days after receiving down payment

Packaging Details : Standard export cartons

Density : 14.5 g/cm3

Thermalconductivity : 90 W/m·K

Shape : Plate and sheet

Hardness : 250-300 HB

Cobalt Content : 6-8%

Impact Toughness : ≥2.5J/cm2

Material : Tungsten and Copper

Original : China

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Tungsten Copper Alloy Materials Electronic Packaging Base Flanges

Tungsten Copper Alloy Sheets: A Fusion of Strength and Conductivity

Innovative engineering solutions often demand materials that can perform under the most challenging conditions. Tungsten Copper Alloy sheets offer a compelling blend of tungsten's robust characteristics with copper's superior conductive abilities, making them indispensable across a wide range of industries.

These sheets harness the power of tungsten, known for its unparalleled density and extraordinary strength. With one of the highest melting points in the metallic world, tungsten ensures that the alloy can resist deformation even in the face of extreme temperatures. This makes the alloy particularly suitable for environments where thermal stability is critical, such as in advanced aerospace components and high-performance electronics.

2,Specifications:

Physical Property Description
Composition Tungsten (W) and Copper (Cu)
Density Typically ranges from 13.5 to 16.5 g/cm³
Melting Point Approximately 3400°C (6150°F) for pure tungsten
Thermal Conductivity Ranges from 180 to 230 W/(m·K)
Electrical Conductivity Ranges from 20 to 60% IACS (International Annealed Copper Standard)
Hardness Typically ranges from 200 to 300 HB (Brinell Hardness)

Tungsten Copper Alloy Materials Electronic Packaging Base Flanges


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